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Aluminum nitride or AlN has the properties of high strength and volume resistivity. Also, it is thermally expandable to high temperatures. It’s used not only as a sintering agent or reinforcing layer in structural ceramics but also for other purposes, particularly in recent years. Its performance in ceramic electronic substrates and packaging materials far surpasses that of aluminum.
The Use of Aluminum NitrideUsed to enhance luminescent materials
Aluminum nitride, also known as AlN, has a maximum band gap of 6.2eV. This gives it a higher photoelectric efficiency than indirect band gap semiconductors. AlN, a vital blue and ultraviolet light emitting material, is used in UV/deep ultraviolet light-emitting devices, ultraviolet laser diodes, as well as ultraviolet detectors.
It is used in ceramics, refractory and other materials.
Aluminum nitride can also be used to sinter structural ceramics. You can use the AlN ceramic’s heat resistance and corrosion resistance to make high temperature, corrosion-resistant parts like crucibles and Al evaporate dishes.
As packaging materials, epoxy/AlN materials must be able to dissipate heat and thermally. This requirement is increasing. Epoxy resin, a polymer material, is easy to cure and has good chemical and mechanical properties. It also has low thermal conductivity. You can increase the material’s strength and thermal conductivity by adding AlN Nanoparticles with high thermal conductivity.
Piezoelectric device application
Aluminum nitride exhibits high resistance, high thermal conductivity (8-10x that of Al2O3), as well as a low expansion coefficient comparable to silicon. It is a great material for high temperature and high power electronic devices.
Apply to substrate material
AlN crystal makes a great substrate for AlGaN, AlN and AlN epitaxial material. AlN and GaN substrates are better than SiC and sapphire. Also, the stress between the substrate & the epitaxial layers is lower than SiC.
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