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Here are some of the key features Spherical Quartz Powder
Smooth surface, large area and high stability of chemical properties are some of the benefits that spherical Quartz powder offers. Spherical powder can be mixed well with resin to make a thin film. A higher amount of quartz powder is better for electronic components. It will also have a lower thermal conductivity. Also, the mold compound has a smaller thermal expansion factor. The stress of spherical granules is 60% less than that of angular powder. Furthermore, the molding compound made with spherical quartz crystal powder has both the lowest stress concentration and highest strength. The surface texture of spherical quartz powder is extremely smooth. It has low friction and wear, which may extend its service life by up to one-third.
|Spherical Quartz Powder Spherical SiO2 Property|
|Other Titles||Fused quartz, spherial quartz, spherical SiO2, silica|
|Melting Point||1,600deg C (2,912deg F)|
|Solubility In Water||N/A|
|– Particle Size||10-30nm|
|Boling Point||2,230deg C (4,046deg F)|
|Exact Mass||59.9668 g/mol|
There are many uses for spherical powdered quartz, with electronic packaging being the most popular. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become increasingly sophisticated, the demands for packaging materials increase. Packaging forms are continually optimized and improved to meet these requirements. Three main types of electronic packaging include substrate, plastic, glue, and frame. The advantages of plastic packaging include its ease-of-use, low cost and ability to be made in mass quantities. Today, 95% of all integrated circuits are made up by plastic packaging. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high humidity, low stress, low pressure, low alpha-rays, dip and reflow welding resistance, as well as good sealing properties. To address this issue, epoxy molding compounds must contain inorganic fillers. Most inorganic materials used currently are silicon micropowder and quartz micropowder. Large-scale, ultra-large-scale microelectronics circuits now have more stringent requirements for packaging material. EMC powder, which is an important supporting material, requires quartz powder to be of the required particle size. Quartz powder also needs its purity.
2. It is a sphere of silicon micropowder that has a good form and can be used to meet the technical needs of high-end integrated systems. This can reduce the temperature expansion coefficient, dielectric constant, and stress of sealing materials. The products also have excellent weather resistance, impact resistance and compression resistance. Apart from being used in electronic packaging, the spherical Quartz powder can be extensively used in manufacturing electronic inks.
The principal supplier Spherical Quartz Powder
Luoyang Tech Co., Ltd. is a company that specializes in professional IT services. oxide powder Over 12 years’ experience in developing and researching chemical products. You can pay by Credit Card, T/T or West Union. We will send the items to overseas customers via FedEx or DHL.
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