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The key features of Spherical Quartz Powder
Spherical quartz powder offers the benefits of a smooth surface and large specific surface area. It also has high hardness and stability. The first is that the spherical material has good fluidity. It can also be mixed with resin evenly to form a film. The greater the amount of quartz powder used to fill the mold, the lower its thermal conductivity. Also, the molding compound’s thermal expansion coefficient will be smaller. Additionally, single crystal silicon has a higher thermal expansion coefficient. This will improve the performance of electronic components. Second, the stress in spherical powder is less than half that of angular powder. Furthermore, the molding compound made with spherical Quartz powder has the lowest stress concentration, and the strongest. The surface of spherical quartz powder is smooth, with a small friction coefficient and minimal wear to the mold, which can increase the mold’s useful life by more than one-third.
|Spherical Quartz Powder Spherical SiO2 Properties|
|Other Titles||Fused quartz, spherial quartz, spherical SiO2, silica|
|Melting Point||1,600deg C (2,912deg F)|
|Solubility of in water||N/A|
|Boling Point||2,230deg C (4,046deg F)|
Spherical quartz powder can be used in many different applications. Electronic packaging is one of the most popular uses. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become more sophisticated, the requirements for packaging materials are rising. Packaging forms are continually optimized and up-dated to meet these new requirements. The main components of electronic packaging include substrate material, plastic packing material, lead frame, and solder. Plastic packaging is a low-cost and easy-to-make product that can be mass produced in large quantities. This has helped it grow rapidly. Plastic packaging is responsible for 95% worldwide integrated circuit market. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high levels of moisture, stress, low alpha-rays, dip soldering, reflow soldering, and plastic sealing. To address this issue, epoxy molding compounds must be doped in the resin matrix with inorganic materials. The majority of inorganic materials currently used are quartz micropowder, or silicon micropowder. Large-scale and ultra-large scale integrated circuits now have more stringent requirements for packaging materials due to their rapid growth. Quartz powder, an important support material for EMC requires that its particle size be within the required packaging range. Additionally, it must be pure. High and low radioactive elements are essential for particle shape. Spheroidization requirements apply to quartz powder.
2. Spherical silicon nanopowder has a great shape and can also meet many technical requirements for high-end integrated circuits. Its use can significantly reduce the thermal expansion coefficient and dielectric constant of plastic sealing materials. Also, it has a great rigidity, weather resistance resistance, impact resistance and compression resistance. The products also have excellent arc resistance insulation properties, UV radiation resistance and UV radiation resistance. In addition to its main use in electronic packaging, spherical Quartz powder can be used extensively in the manufacture and processing of advanced precision ceramics, electronic inks, optical fibres, high-end cosmetics, precision grinding optical devices and components, as well as in fillers for special paint coats.
The main supplier of Spherical Quartz Powder
Tech Co., Ltd. () is a professional oxide powder Over 12 years’ experience in chemical products development and research. We accept credit cards, T/T and West Union payments. We will ship goods overseas via FedEx, DHL and by air or sea to our customers.
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