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1. Crystallography and Product Basics of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic substance made up of silicon and carbon atoms in a 1:1 stoichiometric proportion, differentiated by its impressive polymorphism– over 250 recognized polytypes– all sharing strong directional covalent bonds however varying in piling sequences of Si-C bilayers.
The most technically relevant polytypes are 3C-SiC (cubic zinc blende structure), and the hexagonal kinds 4H-SiC and 6H-SiC, each exhibiting refined variations in bandgap, electron mobility, and thermal conductivity that influence their viability for specific applications.
The toughness of the Si– C bond, with a bond energy of about 318 kJ/mol, underpins SiC’s extraordinary hardness (Mohs firmness of 9– 9.5), high melting factor (~ 2700 ° C), and resistance to chemical deterioration and thermal shock.
In ceramic plates, the polytype is generally picked based on the intended use: 6H-SiC is common in structural applications as a result of its ease of synthesis, while 4H-SiC controls in high-power electronic devices for its exceptional charge provider wheelchair.
The large bandgap (2.9– 3.3 eV relying on polytype) also makes SiC an exceptional electrical insulator in its pure form, though it can be doped to work as a semiconductor in specialized electronic gadgets.
1.2 Microstructure and Phase Pureness in Ceramic Plates
The performance of silicon carbide ceramic plates is critically based on microstructural attributes such as grain size, density, stage homogeneity, and the presence of second phases or pollutants.
High-quality plates are generally fabricated from submicron or nanoscale SiC powders through innovative sintering techniques, leading to fine-grained, fully thick microstructures that make the most of mechanical strength and thermal conductivity.
Impurities such as complimentary carbon, silica (SiO ₂), or sintering aids like boron or aluminum should be carefully regulated, as they can develop intergranular movies that lower high-temperature toughness and oxidation resistance.
Recurring porosity, even at reduced degrees (
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