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Power chips are connected to exterior circuits with product packaging, and their performance depends upon the assistance of the product packaging. In high-power scenarios, power chips are typically packaged as power components. Chip interconnection describes the electric connection on the upper surface of the chip, which is usually aluminum bonding wire in conventional components. ^ Conventional power module package cross-section
Presently, commercial silicon carbide power modules still primarily use the product packaging technology of this wire-bonded traditional silicon IGBT module. They encounter problems such as large high-frequency parasitical criteria, inadequate warmth dissipation ability, low-temperature resistance, and insufficient insulation strength, which restrict using silicon carbide semiconductors. The display of excellent efficiency. In order to fix these issues and fully make use of the huge possible advantages of silicon carbide chips, many new packaging technologies and solutions for silicon carbide power components have actually emerged in recent times.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold cables to copper cords, and the driving force is price decrease; high-power tools have developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost product performance. The better the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to standard bonding packaging approaches, Cu Clip innovation has the complying with advantages:
1. The connection between the chip and the pins is made from copper sheets, which, to a certain level, changes the conventional cable bonding technique between the chip and the pins. As a result, a distinct bundle resistance value, greater present circulation, and far better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can totally save the price of silver plating and inadequate silver plating.
3. The item appearance is entirely regular with regular items and is mostly used in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding approach
Both eviction pad and the Resource pad are clip-based. This bonding approach is much more expensive and complex, however it can accomplish better Rdson and far better thermal results.
( copper strip)
Copper sheet plus cable bonding method
The source pad utilizes a Clip technique, and the Gate makes use of a Cable approach. This bonding approach is slightly less costly than the all-copper bonding approach, conserving wafer area (relevant to very small entrance locations). The process is less complex than the all-copper bonding technique and can acquire much better Rdson and far better thermal impact.
Provider of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire, please feel free to contact us and send an inquiry.
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