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Power chips are attached to outside circuits with packaging, and their performance depends upon the support of the packaging. In high-power scenarios, power chips are usually packaged as power modules. Chip affiliation refers to the electrical connection on the top surface area of the chip, which is typically aluminum bonding cable in typical components. ^ Traditional power component plan cross-section
Today, industrial silicon carbide power components still mainly make use of the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They face problems such as large high-frequency parasitic specifications, insufficient warm dissipation capacity, low-temperature resistance, and insufficient insulation stamina, which restrict using silicon carbide semiconductors. The display screen of exceptional efficiency. In order to fix these problems and completely make use of the significant prospective benefits of silicon carbide chips, several new packaging modern technologies and remedies for silicon carbide power components have emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold cables to copper wires, and the driving pressure is expense decrease; high-power gadgets have actually created from light weight aluminum cables (strips) to Cu Clips, and the driving force is to boost product performance. The higher the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared to conventional bonding packaging approaches, Cu Clip innovation has the following benefits:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the conventional cord bonding technique in between the chip and the pins. Consequently, a distinct bundle resistance worth, greater present circulation, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully save the expense of silver plating and bad silver plating.
3. The product look is totally regular with regular items and is mostly used in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and other areas.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding technique is a lot more costly and complex, yet it can accomplish better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cable bonding approach
The source pad uses a Clip method, and eviction uses a Wire method. This bonding method is a little less expensive than the all-copper bonding technique, conserving wafer location (suitable to very small entrance locations). The process is less complex than the all-copper bonding approach and can obtain far better Rdson and better thermal result.
Vendor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire, please feel free to contact us and send an inquiry.
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